The electronics assembly and packaging industry (Printed circuit board assembly) is constantly adjusting to satisfy the requirements of the newest generation of semiconductors. Smaller footprint device sizes, 2.5D and 3D TSV packaging are just some of the changes that have occurred. With these changes come challenges we can help you solve.

The new advanced designs and emerging technologies make it more critical to get the solder joints perfect the first time. Optimizing reflow soldering, wave soldering and selective soldering processes is where we can help you achieve:

  • More process up time / Increased productivity
  • Improved cost of ownership
  • Overall defect reduction – shorts, icicles,
  • Less waste /material usage